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assembly, with higher values generally preferred. Advanced FR-4 resin systems can combine both high-Tg and high- Td. This will be discussed in detail in Chap. 10. In addition, higher Tg resin systems can be harder and more brittle than lower Tg systems. This can adversely affect productivity in the printed circuit manufacturing process. In particular, the drilling process can be affected as slower drilling, reduced drill bit life or reduced stack heights can be required for high-Tg materials. Lower copper peel strength values and shorter times to delamination can also be correlated with higher Tg values, though other factors influence these properties as well. The time to delamination is a measure of the time it takes for the resin and copper, or resin and reinforcement, to separate or delaminate, and can be correlated to Td. This will also be discussed in Chaps. 8 and 10, in the context of lead-free assembly. This time-to-delamination test utilizes TMA equipment to bring a sample to a specified temperature and then measures the time it takes for failure to occur. Failure is typically delamination between the resin and copper foil, or resin and glass within the laminate. Temperatures of 260 C (T260) and 288 C (T288) are commonly used for this testing.

Decomposition Temperature, Td As a material is heated to higher temperatures, a point is reached where the resin system will begin to decompose. The chemical bonds within the resin system will begin to break down and volatile components will be driven off, reducing the mass of the sample. The decomposition temperature, Td, is a property which describes the point at which this process occurs. The traditional definition of Td is the point where 5 percent of the original mass is lost to decomposition. However, 5 percent is a very large number when multilayer PCB reliability is considered, and temperatures where lower levels of decomposition occur are very important to understand, particularly with respect to lead-free assembly. To illustrate this, consider Fig. 6.4. In Fig. 6.4, you can see curves for two FR-4 materials.The traditional FR-4, a 140 C Tg material in this case, has a decomposition temperature of 320 C by the 5 percent weight loss definition. The enhanced FR-4 has a decomposition temperature of 350 C by the 5 percent weight loss definition. Many standard high-Tg FR-4 materials actually have decomposition

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many IIC I/O expanders. Figure 6.8 illustrates the block diagram of just such an I/O expander. It offers one 8-bit bidirectional port. Up to eight such ICs can be hooked on the same IIC bus to achieve more I/O capability. Figure 6.9 illustrates how the PCF8574 I/O expander IC can be connected to the AVR processor. The INT* output is connected to the INT0 input of the AVR so that by sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I2C-bus. This means that the PCF8574 can remain a simple slave device.

100 95

FR-4 nced Enha 4 l FR-

Condition General comments Journal bearing type Rubbing bearings Oilimpregnated porous metal bearings Rollingelement bearings Externally Hydrodynamic Hydrostatic Self-acting fluid film fluid film gas bearings pressurized gas bearings bearings bearings

Weight %

210

270

Typical Lead-free Temperature Sn/Pb assembly assembly temperature temperature range range 240 C-270 C 210 C-245 C

An analog-to-digital converter (ADC) is a device that converts analog voltage to a digital number. An ADC is used to digitize analog signals. A signal varying with time is sampled at discrete time intervals, and a number representing the amplitude of the signal at the instant is recorded. This is illustrated in Figure 6.10. The code output is on the Y axis and the time is on the X axis. The code output has eight levels, and these can be encoded with three bits. So the encoded binary number ranges from 000 to 111. There are many types of ADC techniques, and we will not go into those details. I will mention the type of ADC when we consider a particular chip. For now, let s see how the AVR processor can be used to encode an external analog signal.

Theoretically Theoretically infinite but infinite but affected by Theoretically affected by infinite infinite number of filtration and stops and number of starts stops and starts

320 350 C

and EMC, provided all critical conductors are buried (lands only) on outer layer(s) of the printed board assembly. Separation of Grounds. The identification and separation of natural groupings of grounds into similar requirements increases the assurance of conformance to product definition requirements. Some of the natural groupings are as follows:

Electrical safety ground Power supply ground Low-level analog ground High-level analog ground Digital ground I/O ground Pulsed power/energy ground

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