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When defining the printed circuit design requirements for a particular assembly, results of an analysis of the grounding elements necessary for proper functional performance must be included 15533 Bypass Capacitors The selection, location, number, and value of the bypass capacitor(s) for PCDs can affect functional circuit performance The purpose of the bypass capacitor is to provide the necessary electrical energy to minimize the effect of a component s normal transient switching and load currents during functional operation The selection, location, and placement of the bypass capacitor can have a significant impact on EMC and a lesser impact on functional performance One of the keys to EMC management is to prevent or minimize the generation and subsequent radiation of electromagnetic fields in the first place 15534 Voltage and Ground Buses.

In the complete design procedure, the shaft material must also be considered to ensure a long lasting application not only for the shaft but also for aerostatic bearings As water is present in air, water particles may chemically react with the shaft and may result in a change in surface properties Therefore, to avoid rusting erosion of shaft surfaces, the journal surface must be such that it is corrosion resistant It is intolerable to have rust anywhere in the system Spindles should be of stainless steel: Austenitic, Martensitic or Ferritic steel These steels are heat treatable to achieve the different core and case properties for various applications Flakes on plated materials will destroy the bearing Thus, plated surfaces are never used for bearings In anticipation of touch down and overloading, the use of very hard materials is always recommended Tungsten carbide coated shafts and bushes are shown to be suitable, for example, in dental drills When overloading is less frequent, a combination of hard and soft materials is often used, for which bronze is recommended

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As operating frequencies and speeds increase, voltage and ground bus distribution systems may function as lump constant shock-excited oscillators The frequency of oscillation is dependent on the series inductances of the voltage and ground bus system and shunt capacitors One of the worst cases is when the voltage and ground buses are placed as railroad rails with the bypass capacitors, and digital integrated circuits are alternated in position like railroad ties bridging between the rails 15535 Voltage and Ground Planes Voltage and ground planes can be an effective means to provide a relatively low resistance and impedance1 to distribute voltage and ground within a PBD However, maximum effectiveness solid metal, with no holes or cutouts for plated through-holes or other necessary features is an unobtainable condition.

Therefore, voltage and ground planes are a compromise in design and requirements due to the necessary holes in the planes for electrical interconnections and component mounting Voltage and Ground Plane Resistance The sheet resistance of solid copper voltage and ground planes is relatively low for most copper foil thicknesses For 35-mm-thick copper foil, the dc (solid) sheet resistance is less than 1 m /sq The dc resistance of copper foil is shown in Eq (152) The (solid) sheet resistance for selected copper foils is shown in Table 153 Due to the almost infinite number of possible variations in the size, placement, and shape of perforated mesh planes, the following data are presented for informational and comparative purposes only RDC = 172 m /sq tm m (152).

4 5 6 I2C - BUS CONTROL 7 SHIFT REGISTER 8 BIT I/O PORT 9 10 11 12 WRITE pulse READ pulse POWER-ON RESET

TABLE 15.3 Solid Area Copper Foil Sheet Resistance Copper thickness, mm 5 9 12 17 26 35 70 Sheet resistance, m /sq 3.44 1.911 1.433 1.012 0.662 0.491 0.246

Resistance models for periodic mesh grid planes2 is of interest for uniform grids, but is of limited use for grid planes that are not periodic and for ac electrical network analysis. Voltage and Ground Plane Impedance. The impedance of perforated mesh voltage and ground planes is difficult to perform due to the number of variations in the size, placement, and shape of perforated mesh planes.

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